Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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16467273
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Filing Dt:
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06/06/2019
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Publication #:
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Pub Dt:
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11/14/2019
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Inventor:
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Tsuyoshi MORITA
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Title:
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METHOD OF POLISHING SILICON WAFER INCLUDING NOTCH POLISHING PROCESS AND METHOD OF PRODUCING SILICON WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 1058634 |
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| GREENBLUM & BERNSTEIN, P.L.C. |
| 1950 ROLAND CLARKE PLACE |
| RESTON, VA 20191 |
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