Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/10/2023
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Application #:
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17354478
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Filing Dt:
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06/22/2021
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Publication #:
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Pub Dt:
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11/24/2022
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Inventors:
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YIN-JU CHEN, JING-CYUAN YANG, YEN-CHANG CHU
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Title:
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METHOD FOR MANUFACTURING CIRCUIT BOARD WITH HEAT DISSIPATION FUNCTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, PENGDING ROAD, HUAI AN CITY,JIANGSU PROVINCE, CHINA |
| HUAI AN, CHINA |
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| B1DG A1-A3, AVARY PARK, SONGLUO RD.,,YANCHUAN COMMUNITY, YANLUO ST., BAO AN DIST., |
| SHENZHEN, CHINA |
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| 8F., NO. 8, BAOQIANG RD., XIXDIAN DIST.,,NEW TAIPEI CITY 23144,TAIWAN (R.O.C.) |
| NEW TAIPEI, TAIWAN |
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| TUNG-YUN MCNALLY |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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