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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11555098
Issue Dt:
01/17/2023
Application #:
17081446
Filing Dt:
10/27/2020
Publication #:
20210047497
Pub Dt:
02/18/2021
Inventors:
Hirokazu KOMORI, Junpei TERADA, Hiroyuki SENDAN, Tadahiro YABU, Yukihiro FUKAGAWA et al
Title:
MOLDING POWDER
Assignment: 1
Reel/Frame:
054184/0091Recorded: 10/27/2020Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KOMORI, HIROKAZU
Exec Dt:
05/29/2019
TERADA, JUNPEI
Exec Dt:
05/31/2019
SENDAN, HIROYUKI
Exec Dt:
06/26/2019
YABU, TADAHIRO
Exec Dt:
07/01/2019
FUKAGAWA, YUKIHIRO
Exec Dt:
06/17/2019
MURAYAMA, KENTA
Exec Dt:
06/17/2019
SHIROMARU, TOMOHIRO
Exec Dt:
05/23/2019
MIYATANI, TOSHIO
Exec Dt:
06/17/2019
KONDOU, MASAHIRO
Exec Dt:
06/19/2019
HAMADA, HIROYUKI
Exec Dt:
06/18/2019
Assignee:
DAIKIN INDUSTRIES, LTD.
UMEDA CENTER BUILDING, 4-12, NAKAZAKI-NISHI 2-CHOME, KITA-KU
OSAKA-SHI, OSAKA, JAPAN 530-8323
Correspondent:
SUGHRUE MION, PLLC
2000 PENNSYLVANIA AVENUE, N.W.
SUITE 900
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
062992/0094Recorded: 12/09/2022Pages: 21
Conveyance:
CHANGE OF ADDRESS
Assignor:
DAIKIN INDUSTRIES, LTD.
Exec Dt:
11/24/2022
Assignee:
DAIKIN INDUSTRIES, LTD.
OSAKA UMEDA TWIN TOWERS SOUTH, 1-13-1, UMEDA, KITA-KU
OSAKA-SHI, OSAKA, JAPAN 530-0001
Correspondent:
SUGHRUE MION, PLLC
2000 PENNSYLVANIA AVENUE, NW
SUITE 9000
WASHINGTON, DC 20006-1811

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