Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/24/2023
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Application #:
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16812843
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Filing Dt:
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03/09/2020
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Publication #:
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Pub Dt:
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09/24/2020
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Inventors:
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Yuji Shioya, MITSURU ETOU, TOMOYUKI HONGOH, Ryo MATSUMOTO, Kazuhiko OHTA
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Title:
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HEAT SINK, BOARD MODULE, TRANSMISSION DEVICE, AND METHOD OF MANUFACTURING THE HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588 |
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| FUJITSU PATENT CENTER |
| 2318 MILL ROAD SW |
| SUITE 1420 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE LISTING OF ASSIGNORS PREVIOUSLY RECORDED AT REEL: 052061 FRAME: 0779. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588 |
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| FUJITSU PATENT CENTER |
| 2318 MILL ROAD SW |
| SUITE 1420 |
| ALEXANDRIA, VA 22314 |
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