Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/24/2023
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Application #:
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16900492
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Filing Dt:
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06/12/2020
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Publication #:
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Pub Dt:
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12/24/2020
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Inventor:
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Hiroyuki OGURI
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Title:
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METHOD FOR INSPECTING SURFACE OF WAFER, DEVICE FOR INSPECTING SURFACE OF WAFER, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, KANAI-CHO, SAKAE-KU |
| YOKOHAMA-SHI |
| KANAGAWA, JAPAN 244-0845 |
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| SMITH, GAMBRELL & RUSSELL, LLP |
| 1055 THOMAS JEFFERSON STREET |
| SUITE 400 |
| WASHINGTON, DC 20007 |
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