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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/31/2023
Application #:
17288519
Filing Dt:
04/24/2021
Publication #:
Pub Dt:
12/16/2021
Inventors:
Tadaaki MIONO, Shinichi KAMOSHIDA, Shinichi KOGA, Yasunori HATTORI
Title:
HOT-DIP PLATING METHOD
Assignment: 1
Reel/Frame:
056087/0111Recorded: 04/29/2021Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/01/2021
Exec Dt:
04/01/2021
Exec Dt:
04/04/2021
Exec Dt:
04/01/2021
Assignee:
6-1, MARUNOUCHI 2-CHOME, CHIYODA-KU
TOKYO, JAPAN 100-8071
Correspondent:
RENNER OTTO
1621 EUCLID AVENUE
19TH FLOOR
CLEVELAND, OH 44115

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