Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2023
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Application #:
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17125191
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Filing Dt:
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12/17/2020
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Publication #:
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Pub Dt:
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04/08/2021
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Inventors:
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Otto CHEN, Chia-Chih Chen
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Title:
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WAFER COOLING SYSTEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C |
| 1100 NEW YORK AVENUE, N.W. |
| WASHINGTON, DC 20005 |
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