Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/07/2023
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Application #:
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17593129
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Filing Dt:
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09/09/2021
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Publication #:
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Pub Dt:
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08/25/2022
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Inventor:
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Peng DONG
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Title:
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WAFER CLEANING APPARATUS AND WAFER CLEANING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| HEFEI, ANHUI, CHINA 230601 |
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| SYNCODA LLC |
| 208 EUPHORIA CIR |
| CARY, NC 27519 |
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