Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/14/2023
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Application #:
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16233156
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Filing Dt:
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12/27/2018
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Publication #:
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Pub Dt:
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07/04/2019
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Inventors:
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Sang Hwa LEE, Yeong Deuk SEO, Sang Hyun HONG
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Title:
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Polyamide Resin Composition and Molded Article Comprising the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 334-27, YEOSUSANDAN-RO |
| YEOSU-SI, JEOLLANAM-DO |
| YEOSU-SI, KOREA, REPUBLIC OF 59616 |
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| ADDITON, HIGGINS & PENDLETON, P.A. |
| 10706 SIKES PLACE |
| SUITE 350 |
| CHARLOTTE, NC 28277 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 300, OLYMPIC-RO SONGPA-GU |
| SEOUL, KOREA, REPUBLIC OF 05551 |
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| ADDITON, PENDLETON & WITHERSPOON, P.A. |
| P.O. BOX 567 |
| MONROE, NC 28111 |
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