Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/14/2023
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Application #:
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17097263
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Filing Dt:
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11/13/2020
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Publication #:
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Pub Dt:
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04/21/2022
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Inventors:
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CHI-TING HUANG, CHING-YU NI, HSIANG-HUA LU, YING-CHIEH PAN
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Title:
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PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3F, NO.1, INNOVATION ROAD II, HSINCHU SCIENCE PARK,HSINCHU 30076, TAIWAN R.O.C |
| HSINCHU, TAIWAN |
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| TUNG-YUN MCNALLY |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 3732, SINO GERMAN ECO-PARK MAKER CENTER, NO. 172 TAIBAISHAN ROAD, QINGDAO AREA OF CHINA (SHANDONG) PILOT FREE TRADE ZONE |
| QINGDAO, CHINA |
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| CALVIN H CHAI |
| 550 S. HOPE STREET, STE 2825 |
| LOS ANGELES, CA 90071 |
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