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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/14/2023
Application #:
16723939
Filing Dt:
12/20/2019
Publication #:
Pub Dt:
04/23/2020
Inventors:
Ali KESHAVARZI, Shu-Hui SUNG, Shyue-Shyh LIN, Chung-Cheng WU, Jung-Chan YANG, Min CAO et al
Title:
INTEGRATED CIRCUITS AND MANUFACTURING METHODS THEREOF
Assignment: 1
Reel/Frame:
051819/0380Recorded: 02/14/2020Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/27/2016
Exec Dt:
04/17/2016
Exec Dt:
03/20/2017
Exec Dt:
01/23/2017
Exec Dt:
05/19/2016
Exec Dt:
03/17/2017
Exec Dt:
03/23/2017
Exec Dt:
01/23/2017
Exec Dt:
01/20/2017
Exec Dt:
03/16/2017
Exec Dt:
05/19/2016
Exec Dt:
05/20/2017
Assignee:
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondent:
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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