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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11581425
Issue Dt:
02/14/2023
Application #:
17198683
Filing Dt:
03/11/2021
Publication #:
20220293773
Pub Dt:
09/15/2022
Inventors:
Tsung-Hsi YANG, Yi-Fang PAI, Chii-Horng LI, Che-Yu LIN, Pei-Ren JENG, Yee-Chia YEO
Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH ENLARGED VOLUMES OF SOURCE-DRAIN REGIONS
Assignment: 1
Reel/Frame:
056070/0572Recorded: 04/28/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YANG, TSUNG-HSI
Exec Dt:
03/29/2021
LIN, CHE-YU
Exec Dt:
03/26/2021
PAI, YI-FANG
Exec Dt:
04/12/2021
JENG, PEI-REN
Exec Dt:
03/16/2021
LI, CHII-HORNG
Exec Dt:
03/30/2021
YEO, YEE-CHIA
Exec Dt:
03/29/2021
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP.
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22040-0747

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