Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/28/2023
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Application #:
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16274477
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Filing Dt:
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02/13/2019
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Publication #:
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Pub Dt:
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06/11/2020
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Inventors:
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Yu-Feng JIN, Sheng-Lin MA, Qian-Cheng ZHAO, Yi-Hsiang CHIU, Huan LIU, Hung-Ping LEE et al
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Title:
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WAFER LEVEL ULTRASONIC CHIP MODULE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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9F, NO. 102, SEC. 3, MINQUAN E. RD., SONGSHAN DIST., |
TAIPEI CITY, TAIWAN 105 |
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SCHOOL OF ELECTRONIC AND COMPUTER ENGINEERING, PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL, PEKING UNIVERSITY |
SHENZHEN, CHINA 518055 |
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MUNCY, GEISSLER, OLDS & LOWE, P.C. |
4000 LEGATO RD., SUITE 310 |
FAIRFAX, VA 22033 |
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Assignment:
2
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ROOM 301, BUILDING 5, HANWEI IOT TECHNOLOGY INDUSTRIAL PARK, NO.32 WUTONG STREET |
ZHENGZHOU HI-TECH INDUSTRIAL DEVELOPMENT ZONE |
ZHENGZHOU, HENAN PROVINCE, CHINA |
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MUNCY, GEISSLER, OLDS & LOWE, PC |
4000 LEGATO RD., SUITE 310 |
FAIRFAX, VA 22033 |
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05/15/2024 03:51 AM
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