Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/07/2023
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Application #:
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17052488
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Filing Dt:
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11/02/2020
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Publication #:
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Pub Dt:
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06/10/2021
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Inventors:
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Changbo SHIM, Yongseon HWANG, Hwayeon MOON, Hee Yong SHIM, Hyunsung MIN
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Title:
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THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, PREPREG AND METAL CLAD LAMINATE USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| DENTONS US LLP |
| 1900 K STREET NW |
| WASHINGTON, DC 20006 |
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