Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/14/2023
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Application #:
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16979841
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Filing Dt:
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09/10/2020
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Publication #:
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Pub Dt:
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02/25/2021
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Inventors:
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Min Cheol JU, Sung Won HONG, Hyung Sub LEE, Min Seung SHIN, In Soo KIM
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Title:
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METHOD FOR PREPARING THERMOPLASTIC COPOLYMER, THERMOPLASTIC COPOLYMER PREPARED THEREFROM, AND THERMOPLASTIC RESIN COMPOSITION INCLUDING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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| AMPACC LAW GROUP, PLLC |
| 6100 219TH ST SW STE 580 |
| MOUNTLAKE TERRACE, WA 98043 |
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