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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/14/2023
Application #:
17189777
Filing Dt:
03/02/2021
Publication #:
Pub Dt:
06/17/2021
Inventors:
Wei-E Wang, Vassilios Gerousis, Mark S. Rodder
Title:
METHOD OF FORMING A THERMAL SHIELD IN A MONOLITHIC 3-D INTEGRATED CIRCUIT
Assignment: 1
Reel/Frame:
056169/0766Recorded: 05/07/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/02/2019
Exec Dt:
04/03/2019
Exec Dt:
04/02/2019
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
LEWIS ROCA ROTHGERBER CHRISTIE LLP
PO BOX 29001
GLENDALE, CA 91209

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