Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/21/2023
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Application #:
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16483990
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Filing Dt:
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08/06/2019
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Publication #:
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Pub Dt:
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01/16/2020
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Inventors:
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Takashi GONDAIRA, Makoto TAI
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Title:
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PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST FILM USING SAID PHOTOSENSITIVE RESIN COMPOSITION, FLEXIBLE PRINTED CIRCUIT AND IMAGE DISPLAY DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-5, MINAMI-HONCHO 1-CHOME |
| JOETSU-SHI, NIIGATA, JAPAN 9438610 |
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| HAUPTMAN HAM, LLP |
| 2318 MILL ROAD |
| SUITE 1400 |
| ALEXANDRIA, VA 22314 |
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