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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/28/2023
Application #:
16930702
Filing Dt:
07/16/2020
Publication #:
Pub Dt:
07/22/2021
Inventors:
Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo et al
Title:
Semiconductor Devices and Methods of Manufacture
Assignment: 1
Reel/Frame:
053228/0719Recorded: 07/16/2020Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/04/2020
Exec Dt:
06/30/2020
Exec Dt:
06/29/2020
Exec Dt:
06/12/2020
Exec Dt:
06/09/2020
Exec Dt:
06/09/2020
Exec Dt:
06/19/2020
Exec Dt:
06/10/2020
Exec Dt:
06/04/2020
Exec Dt:
06/23/2020
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP/TSMC
17950 PRESTON ROAD, SUITE 1000
DALLAS, TX 75252

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