Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/04/2023
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Application #:
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16867335
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Filing Dt:
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05/05/2020
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Publication #:
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Pub Dt:
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11/11/2021
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Inventors:
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Teng Hock KUAH, Yi LIN, Kar Weng YAN, Perez ANGELITO BARROZO
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Title:
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DUAL-SIDED MOLDING FOR ENCAPSULATING ELECTRONIC DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| OSTROLENK FABER LLP |
| 845 THIRD AVENUE |
| 8TH FLOOR |
| NEW YORK, NY 10022 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| OSTROLENK FABER LLP |
| 845 THIRD AVENUE |
| 8TH FLOOR |
| NEW YORK, NY 10022 |
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