Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/11/2023
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Application #:
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16470767
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Filing Dt:
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06/18/2019
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Publication #:
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Pub Dt:
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03/12/2020
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Inventors:
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Makoto HIRAKAWA, Masashi YAMADA
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Title:
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ADHESIVE COMPOSITION, AND COVERLAY FILM, BONDING SHEET, COPPER-CLAD LAMINATE AND ELECTROMAGNETIC SHIELDING MATERIAL, EACH USING SAID ADHESIVE COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-14-1, NISHI-SHIMBASHI |
| MINATO-KU, TOKYO, JAPAN 105-8419 |
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| OBLON, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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