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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/11/2023
Application #:
17055699
Filing Dt:
11/16/2020
Publication #:
Pub Dt:
07/08/2021
Inventors:
Takashi TOJIMA, Yasushi NEMOTO, Tsutomu MORITA, Atsushi OCHIYA
Title:
POWER SEMICONDUCTOR MODULE
Assignment: 1
Reel/Frame:
054377/0690Recorded: 11/16/2020Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/21/2019
Exec Dt:
11/12/2020
Exec Dt:
05/17/2019
Exec Dt:
11/10/2020
Assignee:
6, TAKEDA TOBADONO-CHO
FUSHIMI-KU
KYOTO-SHI, KYOTO, JAPAN 612-8501
Correspondent:
VOLPE KOENIG
30 SOUTH 17TH STREET, 18TH FLOOR
PHILADELPHIA, PA 19103

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