Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/18/2023
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Application #:
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17357443
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Filing Dt:
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06/24/2021
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Publication #:
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Pub Dt:
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10/14/2021
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Inventors:
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Ko Inaba, Tetsu Takemasa, Tadashi Kosuga
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Title:
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SOLDER JOINT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 151 LORONG CHUAN |
| #02-01 NEW TECH PARK |
| SINGAPORE, SINGAPORE 556741 |
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| YUICHI WATANABE |
| 909 FANNIN ST. |
| SUITE 3500 |
| HOUSTON, TX 77010 |
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