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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11631802
Issue Dt:
04/18/2023
Application #:
16677053
Filing Dt:
11/07/2019
Publication #:
20210143322
Pub Dt:
05/13/2021
Inventors:
Vignesh Sundar, Yi Yang, Dongna Shen, Zhongjian Teng, Jesmin Haq, Sahil Patel, Yu-Jen Wang et al
Title:
Etching and Encapsulation Scheme for Magnetic Tunnel Junction Fabrication
Assignment: 1
Reel/Frame:
051530/0207Recorded: 01/16/2020Pages: 12
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
SUNDAR, VIGNESH
Exec Dt:
11/20/2019
YANG, YI
Exec Dt:
10/20/2019
SHEN, DONGNA
Exec Dt:
09/27/2019
TENG, ZHONGJIAN
Exec Dt:
09/27/2019
HAQ, JESMIN
Exec Dt:
10/02/2019
PATEL, SAHIL
Exec Dt:
10/14/2019
WANG, YU-JEN
Exec Dt:
10/20/2019
ZHONG, TOM
Exec Dt:
10/02/2019
Assignee:
HEADWAY TECHNOLOGIES, INC.
678 S. HILLVIEW DRIVE
MILPITAS, CALIFORNIA 95035
Correspondent:
SAILE ACKERMAN LLC
28 DAVIS AVENUE
POUGHKEEPSIE, NY 12603

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