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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/25/2023
Application #:
17855942
Filing Dt:
07/01/2022
Publication #:
Pub Dt:
01/12/2023
Inventors:
Martin Thuo, Ian Tevis, Darin Heisterkamp
Title:
SOLDER PASTE ON DEMAND APPARATUS
Assignment: 1
Reel/Frame:
060498/0985Recorded: 07/13/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/07/2021
Exec Dt:
07/08/2021
Exec Dt:
07/08/2021
Assignee:
536 FARMHOUSE LN.
1575 FOOD SCIENCES BLDG
AMES, IOWA 50011
Correspondent:
BROWNWINICK LAW FIRM
666 GRAND AVE., SUITE 2000
DES MOINES, IA 50309
Assignment: 2
Reel/Frame:
064455/0785Recorded: 08/01/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/27/2023
Assignee:
301 WOODS PARK DRIVE
CLINTON, NEW YORK 13323
Correspondent:
SHEPPARD, MULLIN, RICHTER & HAMPTON LLP
650 TOWN CENTER DRIVE, 4TH FLOOR
COSTA MESA, CA 92626

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