Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/09/2023
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Application #:
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17013279
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Filing Dt:
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09/04/2020
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Publication #:
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Pub Dt:
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09/30/2021
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Inventors:
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Jie-Hua Zhao, Po-Hao Chang, Ying-Chieh Ke, Wei Chen, Jun Zhai, Hsien-Che Lin, Kunzhong Hu
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Title:
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Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE APPLE PARK WAY |
| CUPERTINO, CALIFORNIA 95014 |
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| JAFFERY WATSON MENDONSA & HAMILTON LLP |
| 7501 VILLAGE SQUARE DRIVE, SUITE 206 |
| CASTLE PINES, CO 80108 |
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