Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/09/2023
|
Application #:
|
16954724
|
Filing Dt:
|
06/17/2020
|
|
Publication #:
|
|
Pub Dt:
|
12/10/2020
| | | | |
|
Inventors:
|
Takehiko TANAKA, Bojie ZHAO, Ye WU, Zhewen MEI, Mingzhu WANG
|
|
Title:
|
PHOTOSENSITIVE ASSEMBLY, PHOTOGRAPHING MODULE, AND PHOTOSENSITIVE ASSEMBLY JOINTED BOARD AND CORRESPONDING MANUFACTURING METHOD THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 66-68 SHUNYU ROAD, YUYAO CITY, |
| NINGBO ZHEJIANG, CHINA 315400 |
|
|
|
|
| WENDEROTH, LIND & PONACK, L.L.P. |
| 1025 CONNECTICUT AVE NW |
| SUITE 500 |
| WASHINGTON, DC 20036 |
|
|
Search Results as of:
05/02/2024 06:11 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
