Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2023
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Application #:
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17650845
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Filing Dt:
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02/12/2022
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Inventors:
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Nicholas A. Polomoff, Yusheng Bian, Thomas Houghton
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Title:
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PIC DIE AND PACKAGE WITH COVER FOR MULTIPLE LEVEL AND MULTIPLE DEPTH CONNECTIONS OF FIBERS TO ON-CHIP OPTICAL COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 400 STONEBREAK ROAD EXTENSION |
| MALTA, NEW YORK 12020 |
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| HOFFMAN WARNICK LLC |
| 540 BROADWAY |
| 4TH FLOOR |
| ALBANY, NY 12207 |
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05/22/2024 08:43 AM
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