Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/16/2023
|
Application #:
|
17452824
|
Filing Dt:
|
10/29/2021
|
|
Publication #:
|
|
Pub Dt:
|
02/17/2022
| | | | |
|
Inventors:
|
DeokKyung Yang, HunTeak Lee, SungSoo Kim, HeeSoo Lee
|
|
Title:
|
Semiconductor Device and Method of Forming Embedded Die Substrate, and System-in-Package Modules with the Same
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
|
|
|
|
| PATENT LAW GROUP: ATKINS AND ASSOCIATES, P.C. |
| 123 W. CHANDLER HEIGHTS ROAD, #12535 |
| CHANDLER, AZ 85248 |
|
|
Search Results as of:
05/10/2024 12:20 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
