Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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17640973
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Filing Dt:
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03/07/2022
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Publication #:
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Pub Dt:
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08/25/2022
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Inventors:
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Yoshitaka AYUZAWA, Ryo UMEKI, Kensaku MAEDA
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Title:
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POLYAMIDE RESIN COMPOSITION AND POLYAMIDE RESIN MOLDED ARTICLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-8, DOJIMA HAMA 2-CHOME |
| KITA-KU, OSAKA-SHI |
| OSAKA, JAPAN 5308230 |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| 1025 CONNECTICUT AVENUE NW |
| SUITE 500 |
| WASHINGTON, DC 20036 |
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Assignment:
2
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ABSORPTION-TYPE COMPANY SPLIT
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| OSAKA UMEDA TWIN TOWERS SOUTH, |
| 13-1, UMEDA 1-CHOME, KITA-KU, OSAKA-SHI |
| OSAKA, JAPAN 5300001 |
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| WENDEROTH, LIND & PONACK L.L.P |
| 1025 CONNECTICUT AVENUE NW |
| SUITE 500 |
| WASHINGTON, DC 20036 |
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