Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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17956239
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Filing Dt:
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09/29/2022
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Inventors:
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Sheau Jiung Lee, Hongyu Zhang
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Title:
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BUS PIPELINE STRUCTURE FOR DIE-TO-DIE INTERCONNECT AND CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING C, NO. 888, HUANHU WEST 2ND ROAD |
| LINGANG NEW AREA |
| CHINA (SHANGHAI) PILOT FREE TRADE ZONE, CHINA 201306 |
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| SUSAN RYAN |
| 129 W. EVESHAM ROAD |
| VOORHEES, NJ 08043 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| WORKSTATION 28, ROOM 415, 4/F, BLOCK A, ZHONGCHUANG SERVICE CENTRE, NO.1 XIHU ROAD |
| WUJIN NATIONAL HI-TECH INDUSTRIAL DEVELOPMENT ZONE, JIANGSU PROVINCE |
| CHANGZHOU, CHINA 213164 |
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| MARIAH WYSOCKI |
| 129 W. EVESHAM ROAD |
| VOORHEES, NJ 08043 |
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