Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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16716397
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Filing Dt:
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12/16/2019
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Publication #:
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Pub Dt:
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06/18/2020
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Inventors:
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Tuqiang Ni, Jinlong Zhao, Yunwen Huang, Jie Liang, Lei Wu
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Title:
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Capacitively Coupled Plasma Etching Apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 188 TAIHUA ROAD, JINQIAO EXPORT PROCESSING ZONE (SOUTH AREA) PUDONG |
| SHANGHAI, CHINA 201201 |
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| WOMBLE BOND DICKINSON (US) LLP |
| ATTN: IP DOCKETING |
| P.O. BOX 7037 |
| ATLANTA, GA 30537-7037 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 188 TAIHUA ROAD, JINQIAO EXPORT PROCESSING ZONE (SOUTH AREA) PUDONG |
| SHANGHAI, CHINA 201201 |
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| WOMBLE BOND DICKINSON (US) LLP |
| ATTN: IP DOCKETING |
| PO BOX 7037 |
| ATLANTA, GA 30357-0037 |
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05/14/2024 01:23 PM
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