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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
06/06/2023
Application #:
17308321
Filing Dt:
05/05/2021
Publication #:
Pub Dt:
07/14/2022
Inventors:
Tzy-Kuang Lee, Ching-Hung Kao, Wen-Chun Wang, Chih-Hsien Lin, Yen-Yu Chen
Title:
REDISTRIBUTION LAYER FEATURES
Assignment: 1
Reel/Frame:
056142/0163Recorded: 05/05/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/16/2021
Exec Dt:
02/15/2021
Exec Dt:
02/22/2021
Exec Dt:
02/18/2021
Exec Dt:
02/16/2021
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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