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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11675274
Issue Dt:
06/13/2023
Application #:
16484582
Filing Dt:
08/08/2019
Publication #:
20190354020
Pub Dt:
11/21/2019
Inventors:
Yongfa FAN, Leiwu ZHENG, Mu FENG, Qian ZHAO, Jen-Shiang WANG
Title:
ETCH BIAS CHARACTERIZATION AND METHOD OF USING THE SAME
Assignment: 1
Reel/Frame:
050002/0094Recorded: 08/08/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
FAN, YONGFA
Exec Dt:
03/02/2017
ZHENG, LEIWU
Exec Dt:
03/02/2017
FENG, MU
Exec Dt:
03/02/2017
ZHAO, QIAN
Exec Dt:
03/02/2017
WANG, JEN-SHIANG
Exec Dt:
03/02/2017
Assignee:
ASML NETHERLANDS B.V.
P.O. BOX 324
VELDHOVEN, NETHERLANDS 5500 AH
Correspondent:
PILLSBURY WINTHROP SHAW PITTMAN LLP(ASML
P.O. BOX 10500
MCLEAN, VA 22102

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