Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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16998451
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Filing Dt:
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08/20/2020
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Publication #:
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Pub Dt:
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02/24/2022
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Inventors:
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David Abraham, Shawn Anthony Hall, John Michael Cotte
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Title:
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COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| VENABLE LLP (IBM CORPORATION - YORKTOWN) |
| P.O. BOX 34385 |
| WASHINGTON, DC 20043-9998 |
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