Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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17500931
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Filing Dt:
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10/13/2021
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Publication #:
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Pub Dt:
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03/03/2022
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Inventors:
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Joseph WANG, Rajan Kumar, Ying Shirley Meng, Jae Wook Shin, Lu Yin
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Title:
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HYPERELASTIC BINDER FOR PRINTED, STRETCHABLE ELECTRONICS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1111 FRANKLIN ST. |
| 5TH FLOOR |
| OAKLAND, CALIFORNIA 94607-5200 |
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| PERKINS COIE LLP |
| P.O. BOX 1247 |
| SEATTLE, WA 98111-1247 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1111 FRANKLIN ST. |
| 5TH FLOOR |
| OAKLAND, CALIFORNIA 94607-5200 |
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| PERKINS COIE LLP |
| P.O. BOX 1247 |
| SEATTLE, WA 98111-1247 |
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05/06/2024 01:35 PM
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