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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11682612
Issue Dt:
06/20/2023
Application #:
17235944
Filing Dt:
04/21/2021
Publication #:
20220344248
Pub Dt:
10/27/2022
Inventors:
John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Kai-Ming Yang, Chi-Hai Kuo, Chia-Yu Peng et al
Title:
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
056030/0972Recorded: 04/26/2021Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LAU, JOHN HON-SHING
Exec Dt:
03/04/2021
KO, CHENG-TA
Exec Dt:
02/26/2021
LIN, PU-JU
Exec Dt:
02/26/2021
YANG, KAI-MING
Exec Dt:
02/26/2021
KUO, CHI-HAI
Exec Dt:
02/26/2021
PENG, CHIA-YU
Exec Dt:
02/26/2021
TSENG, TZYY-JANG
Exec Dt:
03/05/2021
Assignee:
UNIMICRON TECHNOLOGY CORP.
NO. 179, SHANYING RD., GUISHAN DIST.,
TAOYUAN CITY, TAIWAN 333
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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