Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/20/2023
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Application #:
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17103810
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Filing Dt:
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11/24/2020
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Publication #:
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Pub Dt:
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05/26/2022
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Inventors:
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Mukta Ghate Farooq, James J. Kelly
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Title:
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PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| GABRIEL DANIEL |
| INTELLETEK LAW GROUP, PLLC |
| 800 2ND AVENUE, SUITE 804 |
| NEW YORK, NY 10017 |
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