Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/27/2023
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Application #:
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16982519
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Filing Dt:
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09/18/2020
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Publication #:
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Pub Dt:
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01/07/2021
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Inventors:
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John HONG, Tallis CHANG, Edward CHAN, Bing WEN, Yaoling PAN, Kenji NOMURA
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Title:
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CAPPING PLATE FOR PANEL SCALE PACKAGING OF MEMS PRODUCTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5754 PACIFIC CENER BLVD., SUITE 201 |
| SAN DIEGO, CALIFORNIA 92121 |
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| DESMOND O'SULLIVAN |
| MORRISON & FOERSTER |
| 12531 HIGH BLUFF DRIVE, SUITE 100 |
| SAN DIEGO, CA 92130 |
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