Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/27/2023
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Application #:
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16927438
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Filing Dt:
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07/13/2020
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Publication #:
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Pub Dt:
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03/11/2021
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Inventors:
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Hongfeng ZHU, Jun YI, Bo WANG, Jian LIU, Qibin ZHU
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Title:
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CHIP WIRING LAYER TEMPERATURE SENSING CIRCUIT, TEMPERATURE SENSING METHOD AND CHIP THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 506, BUILDING 12, CHINA AI TOWN, NO. 1818-2 WEN YI W. RD., YUHANG COMMUNITY, YUHANG DISTRICT |
| HANGZHOU, ZHEJIANG PROVINCE, 321031, CHINA |
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| MUNCY, GEISSLER, OLDS & LOWE, P.C. |
| 4000 LEGATO ROAD, SUITE 310 |
| FAIRFAX, VA 22033 |
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