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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/04/2023
Application #:
17467045
Filing Dt:
09/03/2021
Publication #:
Pub Dt:
10/20/2022
Inventors:
Yen-Yu CHEN, Ying-Tang CHAO, Shin-Kung CHEN
Title:
TEST HEAD ASSEMBLY FOR SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
057387/0019Recorded: 09/03/2021Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/03/2021
Exec Dt:
09/03/2021
Exec Dt:
09/03/2021
Assignee:
NO.10, DATONG RD.
HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 30352
Correspondent:
PATENTTM.US JAMES H. WALTERS
205 SE SPOKANE ST STE 300
PORTLAND, OR 97202-6487

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