Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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16610756
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Filing Dt:
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11/04/2019
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Inventors:
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Rongrong ZHANG, Lei ZHOU, Yingchong LU, Xiangli SUN
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Title:
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Electronic Expansion Valve, Thermal Management Assembly, Cooling System, and Method for Manufacturing Electronic Expansion Valve
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 301, 12TH STREET |
| HANGZHOU ECONOMIC & TECHNOLOGICAL DEVELOPMENT AREA |
| HANGZHOU, CHINA 310018 |
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| BOYLE FREDRICKSON S.C. |
| 840 NORTH PLANKINTON AVENUE |
| MILWAUKEE, WI 53203 |
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