Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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17522067
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Filing Dt:
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11/09/2021
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Publication #:
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Pub Dt:
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06/09/2022
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Inventors:
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Tatsuji NAGAOKA, Hiroki MIYAKE, Hiroyuki NISHINAKA, Yuki KAJITA, Masahiro YOSHIMOTO
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Title:
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WAFER PROCESSING APPARATUS AND METHOD FOR PROCESSING WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHOWA-CHO |
| KARIYA-CITY, AICHI-PREF., JAPAN 448-8661 |
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| 1, TOYOTA-CHO |
| TOYOTA-SHI, AICHI-KEN, JAPAN 471-8571 |
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| 500-1 MINAMIYAMA, KOMENOKI-CHO |
| NISSHIN-SHI, AICHI-KEN, JAPAN 470-0111 |
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| 1, MATSUGASAKI HASHIKAMI-CHO, SAKYO-KU |
| KYOTO-SHI, KYOTO, JAPAN 606-8585 |
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| POSZ LAW GROUP, PLC |
| 12040 SOUTH LAKES DRIVE |
| SUITE 101 |
| RESTON, VA 20191 |
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