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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/11/2023
Application #:
17353047
Filing Dt:
06/21/2021
Publication #:
Pub Dt:
12/22/2022
Inventors:
Thomas Stoek, Frank Daeche, Chee Voon Tan
Title:
POWER SEMICONDUCTOR MODULE FOR PCB EMBEDDING, POWER ELECTRONIC ASSEMBLY HAVING A POWER MODULE EMBEDDED IN A PCB, AND CORRESPONDING METHODS OF PRODUCTION
Assignment: 1
Reel/Frame:
057008/0106Recorded: 07/28/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/30/2021
Exec Dt:
07/07/2021
Exec Dt:
07/01/2021
Assignee:
AM CAMPEON 1-15
NEUBIBERG, GERMANY 85579
Correspondent:
MURPHY, BILAK & HOMILLER/INFINEON
1255 CRESCENT GREEN, SUITE 200
CARY, NC 27518

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