Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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17529972
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Filing Dt:
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11/18/2021
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Publication #:
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Pub Dt:
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05/18/2023
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Inventors:
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Keita TSUCHIYA, Shuuichi KARIYAZAKI
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Title:
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SEMICONDUCTOR DEVICE HAVING WIRING SUBSTRATE WITH LEAD-OUT WIRINGS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-24, TOYOSU 3-CHOME, KOTO-KU |
| TOKYO, JAPAN 135-0061 |
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| TOMOKI TANIDA |
| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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05/02/2024 06:26 PM
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