Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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16954897
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Filing Dt:
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06/17/2020
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Publication #:
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Pub Dt:
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12/03/2020
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Inventors:
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Kyung Yul BAE, Hyun Jee YOO, Jung Woo LEE, Se Woo YANG
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Title:
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ENCAPSULATION FILM INCLUDING METAL LAYER AND PROTECTIVE LAYER WITH RESIN COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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128, YEOUI-DAERO, YEONGDEUNGPO-GU |
SEOUL, KOREA, REPUBLIC OF 07336 |
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DENTONS US LLP |
1900 K STREET NW |
WASHINGTON, DC 20006 |
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05/17/2024 11:37 AM
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