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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/18/2023
Application #:
16200010
Filing Dt:
11/26/2018
Publication #:
Pub Dt:
06/06/2019
Inventors:
Tyler Yost, Daniel R. Wiederin, Beau Marth, Jared Kaser, Jonathan Hein, Jae Seok Lee et al
Title:
SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A SEMICONDUCTING WAFER
Assignment: 1
Reel/Frame:
048442/0532Recorded: 02/26/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/07/2019
Exec Dt:
02/06/2019
Exec Dt:
02/06/2019
Exec Dt:
02/06/2019
Exec Dt:
02/06/2019
Exec Dt:
02/07/2019
Exec Dt:
02/12/2019
Exec Dt:
02/26/2019
Assignee:
7277 WORLD COMMUNICATIONS DRIVE
OMAHA, NEBRASKA 68122
Correspondent:
ADVENT, LLP
THE ADVENT BUILDING
17838 BURKE STREET, SUITE 200
OMAHA, NE 68118

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