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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11705365
Issue Dt:
07/18/2023
Application #:
17323381
Filing Dt:
05/18/2021
Publication #:
20220375787
Pub Dt:
11/24/2022
Inventors:
Wei-Sheng LEI, Roman GOUK, Kyuil CHO, Han-Wen CHEN, Kurtis LESCHKIES, Giback PARK et al
Title:
METHODS OF MICRO-VIA FORMATION FOR ADVANCED PACKAGING
Assignment: 1
Reel/Frame:
056510/0786Recorded: 06/11/2021Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LEI, WEI-SHENG
Exec Dt:
05/26/2021
LESCHKIES, KURTIS
Exec Dt:
05/27/2021
GOUK, ROMAN
Exec Dt:
06/10/2021
PARK, GIBACK
Exec Dt:
05/27/2021
CHO, KYUIL
Exec Dt:
05/26/2021
CHAKRABORTY, TAPASH
Exec Dt:
05/27/2021
CHEN, HAN-WEN
Exec Dt:
06/10/2021
VERHAVERBEKE, STEVEN
Exec Dt:
05/26/2021
Assignee:
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
JOSEPH J. STEVENS
24 GREENWAY PLAZA, SUITE 1600
HOUSTON, TX 77046

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