Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/18/2023
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Application #:
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17461737
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Filing Dt:
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08/30/2021
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Publication #:
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Pub Dt:
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03/02/2023
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Inventors:
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Yung-Chang JEN, Shao Yong CHEN, Chih-Teng LIAO, Bo-Ting LIAO, Tsung-Yi Tseng et al
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Title:
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ETCHING APPARATUS AND METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| SEED IP LAW GROUP LLP |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104 |
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