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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/25/2023
Application #:
17226851
Filing Dt:
04/09/2021
Publication #:
Pub Dt:
08/11/2022
Inventors:
Jung-Chien Cheng, Kuo-Cheng Chiang, Shi Ning Ju, Guan-Lin Chen, Chih-Hao Wang et al
Title:
Hybrid Semiconductor Device
Assignment: 1
Reel/Frame:
055880/0922Recorded: 04/09/2021Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/28/2021
Exec Dt:
03/02/2021
Exec Dt:
02/27/2021
Exec Dt:
02/26/2021
Exec Dt:
03/22/2021
Exec Dt:
03/01/2021
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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