Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/01/2023
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Application #:
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16915601
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Filing Dt:
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06/29/2020
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Publication #:
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Pub Dt:
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10/15/2020
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Inventors:
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Zhaoxing HUANG, Hong TANG, Huikai XIE, Yiwen CHEN, Danyang YAO, Chendi JIANG
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Title:
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MEMS CHIP STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HUAWEI ADMINISTRATION BUILDING |
| BANTIAN, LONGGANG DISTRICT |
| SHENZHEN, GUANGDONG, CHINA 518129 |
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| ROOM 210, BUILDING G10, CHINA SENSOR NETWORK INTERNATIONAL INNOVATION PARK, 200 LINGHU AVENUE |
| WUXI NEW DISTRICT WUXI, JIANGSU, CHINA 214028 |
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| LEYDIG, VOIT & MAYER, LTD. |
| TWO PRUDENTIAL PLAZA, SUITE 4900 |
| 180 NORTH STETSON AVENUE |
| CHICAGO, IL 60601-6731 |
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